Mechanical behavior of composite materials with embedded printed electronics: Influence of substrate material and location
     Topic(s) : Multifunctional and smart composites

    Co-authors​ :

     Rémi TRINTA (FRANCE), Jean-Baptiste CASIMIR , Anurag PISUPATI (FRANCE), Julien BROCAIL (FRANCE), Romain AGOGUÉ (FRANCE), Lionel TENCHINE (FRANCE), Alexandre BEIGBEDER  

    Abstract :
    Over the past decades, sensors and actuators have been combined with fiber reinforced composite materials to improve and increase their functionalities as well as to monitor their structural integrity [1]. However, when these sensors are introduced into a heterogenous system such as composite materials, they tend to deteriorate the mechanical performance of the composites. While rarely studied, printed electronics (PE) have significant potential for integration within composite structures [2]. Their unique form factors, such as thinness and flexibility, align well with the complex shapes that composite parts can take. Moreover, a notable advantage lies in the multiple printing possibilities on a single substrate: sensors, displays, human-machine interfaces, interconnects, heating elements, etc. However, integrating a foreign element into a host composite structure can lead to certain issues such as the reduction of load-carrying capacity, structural life, or strength due to the generation of material and geometric discontinuities within the structure [3]. Therefore, with respect to structural performance, the effects of integrated sensors on the host structure may raise concerns. Despite the low thickness of PE, the creation of new interfaces may significantly affect the overall macroscopic behavior of the composite.

    The presented work involves the qualification and quantification of the structural integrity of a glass fiber/epoxy composite, instrumented with polyethylene terephthalate (PET) insert commonly used in the PE applications. This study aims to address a gap in the existing literature by investigating the implications of incorporating PEs, with a particular interest in the contribution of the substrate and its location within the layup on mechanical properties and fracture mechanisms of the structure. A total of 6 configurations refering to different locations of the substrate are investigated. The mechanical behavior of each configuration is analyzed, and fracture profiles and damaged regions are identified for every test and configuration by scanning electron microscope and µCT observations (figure 1). Integration of PET substrates showed no influence on the tensile properties of composites. However, substrate integration led to a reduction of 10% and 50% in bending strength and ILSS respectively, depending on the location of the substrate (figure 2). Furthermore, µCT observations show that the damage mechanisms and propagation patterns are also closely tied to the presence and positioning of the substrate within the composite. Preliminary insights are obtained regarding preferences for embedding location. This fundamental exploration is essential for designing a composite structures with optimal performance for various applications [4].